Ukuvikelwa kwemvelo kunakwa kakhulu nangokwengeziwe, ikakhulukazi ngokwanda kwesimo sezulu senkungu.Ubunjiniyela bamagumbi ahlanzekile kungenye yezinyathelo zokuvikela imvelo.Ungayisebenzisa kanjani ubunjiniyela begumbi elihlanzekile ukwenza umsebenzi omuhle ekuvikelweni kwemvelo?Ake sikhulume ngokulawula kubunjiniyela bamagumbi ahlanzekile.
Ukulawula izinga lokushisa nomswakama ekamelweni elihlanzekile
Izinga lokushisa kanye nomswakama wezindawo ezihlanzekile kunqunywa ngokuyinhloko ngokusekelwe ezidingweni zenqubo, kodwa lapho uhlangabezana nezidingo zenqubo, ukunethezeka komuntu kufanele kucatshangelwe.Ngokuthuthukiswa kwezidingo zokuhlanzeka komoya, kunomkhuba wezidingo eziqinile zamazinga okushisa kanye nomswakama oqhubekayo.
Njengomthetho ojwayelekile, ngenxa yokunemba okwandayo kokucubungula, izidingo zobubanzi bokushintshashintsha kwezinga lokushisa ziba zincane futhi zibe zincane.Isibonelo, kunqubo ye-lithography kanye nokuchayeka yokukhiqizwa kwesekethe enkulu ehlanganisiwe, umehluko ku-coefficient yokwandisa okushisayo phakathi kwengilazi namawafa e-silicon asetshenziswa njengezinto zamaski uya ngokuya uba mncane.
Iwafa ye-silicon enobubanzi obungu-100 μ m ibangela ukunwetshwa komugqa okungu-0.24 μ m lapho izinga lokushisa likhuphuka ngo-1 degree.Ngakho-ke, izinga lokushisa elingaguquki elingu-± 0.1 ℃ liyadingeka, futhi inani lomswakama ngokuvamile liphansi ngoba ngemva kokujuluka, umkhiqizo uzongcoliswa, ikakhulukazi kuma-workshops we-semiconductor abesaba i-sodium.Lolu hlobo lweshabhu akufanele ludlule ku-25 ℃.
Umswakama owedlulele udala izinkinga eziningi.Uma umswakama ohlobene udlula ama-55%, ukujiya kuzokwakheka odongeni lwamapayipi amanzi okupholisa.Uma kwenzeka kumadivayisi anembayo noma amasekhethi, kungabangela izingozi ezihlukahlukene.Uma umswakama ohlobene ungama-50%, kulula ukugqwala.Ngaphezu kwalokho, lapho umswakama uphezulu kakhulu, uthuli olunamathele ebusweni be-silicon wafer luzokhangiswa ngamakhemikhali phezulu ngama-molecule amanzi emoyeni, okunzima ukuwasusa.
Ukuphakama komswakama ohlobene, kuba nzima ukususa ukunamathela.Kodwa-ke, lapho umswakama ohlobene ungaphansi kuka-30%, izinhlayiya nazo zikhangiswa kalula endaweni ngenxa yesenzo samandla e-electrostatic, futhi inani elikhulu lamadivaysi e-semiconductor athambekele ekuwohlokeni.Ibanga lokushisa elilungile lokukhiqizwa kwe-silicon wafer ngu-35-45%.
Umfutho womoyaukulawulaekamelweni elihlanzekile
Ezindaweni eziningi ezihlanzekile, ukuze kuvinjelwe ukungcola kwangaphandle ekuhlaseleni, kuyadingeka ukugcina ukucindezela kwangaphakathi (ukucindezela okumile) kuphakeme kunokucindezela kwangaphandle (ukucindezela okumile).Ukugcinwa komehluko wengcindezi ngokuvamile kufanele kuhambisane nalezi zimiso ezilandelayo:
1. Ingcindezi ezindaweni ezihlanzekile kufanele ibe phezulu kunaleyo yezindawo ezingahlanzekile.
2. Ingcindezi ezindaweni ezinamazinga aphezulu okuhlanzeka kufanele ibe phezulu kunaleyo esezindaweni eziseduze ezinamazinga aphansi okuhlanzeka.
3. Iminyango phakathi kwamakamelo ahlanzekile kufanele ivulwe ibheke emakamelweni anamazinga aphezulu okuhlanzeka.
Ukugcinwa komehluko wengcindezi kuncike enanini lomoya omusha, okufanele ukwazi ukukhokhela ukuvuza komoya kusuka egebeni ngaphansi kwalo mehluko wengcindezi.Ngakho-ke incazelo engokomzimba yomehluko wengcindezi ukumelana nokuvuza (noma ukungena) ukugeleza komoya ngezikhala ezihlukahlukene egumbini elihlanzekile.
Isikhathi sokuthumela: Jul-21-2023