Ukuvikelwa kwemvelo kukhokhwe ngokwengeziwe futhi kwanakwa ngokwengeziwe, ikakhulukazi ngokwanda kwesimo sezulu seHaze. Ubunjiniyela begumbi elihlanzekile bungenye yezindlela zokuvikela ezemvelo. Ungayisebenzisa kanjani ubunjiniyela begumbi elihlanzekile ukwenza umsebenzi omuhle ekuvikelweni kwemvelo? Ake sixoxe ngokulawulwa kubunjiniyela begumbi elihlanzekile.
Ukulawulwa kokushisa kanye nomswakama egumbini elihlanzekile
Izinga lokushisa kanye nomswakama wezikhala ezihlanzekile zinqunywa ikakhulu ngokusekelwe kwizidingo zenqubo, kepha lapho izidingo zenqubo zokuhlangana, induduzo yabantu kufanele ibhekwe. Ngokuthuthuka kwezidingo zokuhlanzeka komoya, kunomkhuba wezidingo eziqinile zokushisa kanye nomswakama kwinqubo.
Njengomgomo ojwayelekile, ngenxa yokunemba okwandayo kokucutshungulwa, izidingo zebanga lokuguquguquka lokushisa liba lincane futhi lincane. Isibonelo, kwinqubo ye-Lithography kanye nenqubo yokuvezwa kokukhiqizwa kwesifunda okukhulu okuhlangene, umehluko ekukhuliseni kahle kwengilazi kanye ne-silicon ama-wafers asetshenziswa njengoba kukhula okuncane.
I-silicon wafer enobubanzi be-100 μ m ababangela ukwanda okuqondile kwe-0.24 μ lapho izinga lokushisa liphuma nge-1 degree. Ngakho-ke, izinga lokushisa eli-± 0,1 ℃ liyadingeka, futhi inani lomswakama liphansi kakhulu ngoba ngemuva kokujuluka, umkhiqizo uzongcoliswa, ikakhulukazi ezindaweni zokusebenzela ezesaba i-sodium. Lolu hlobo lomhlangano akufanele ludlule ku-25 ℃.
Umswakama owedlulele ubangela izinkinga eziningi. Lapho umswakama ohlobene udlula ama-55%, kuzokhethwa amandla odongeni lwamapayipi wamanzi apholile. Uma kwenzeka kumadivayisi noma amasekethe, kungadala izingozi ezahlukahlukene. Lapho umswakama ohlobene uneminyaka engama-50%, kulula ukugqwala. Ngaphezu kwalokho, lapho umswakama uphezulu kakhulu, uthuli olunamathela ebusweni be-silicon wafer luzohlelwa ngamakhemikhali phezu kwama-molecule wamanzi emoyeni, okunzima ukuwakhipha.
Lapho kukhuphuka umswakama ohlobene, okunzima ukususa ukunamathela. Kodwa-ke, lapho umswakama ohlobene ungaphansi kwama-30%, izinhlayiya nazo zihlelwe kalula ebusweni ngenxa yesenzo se-electrostatic Force, futhi inani elikhulu lamadivayisi we-semiconductor athambekele ekuphuleni. Uhla lokushisa oluphelele lokushisa lwe-silicon wafer ukukhiqizwa lungama-35-45%.
Umfutho womoyaphathaegumbini elihlanzekile
Ezindaweni ezihlanzekile kakhulu, ukuze kuvikeleke ukungcoliswa kwangaphandle kusuka ekuhlaselweni, kuyadingeka ukugcina ingcindezi yangaphakathi (ingcindezi ye-tuli) ephakeme kunengcindezi yangaphandle (ingcindezi ye-tuli). Ukulondolozwa komehluko wengcindezi kufanele kuhambisane nalezi zimiso ezilandelayo:
1. Ingcindezi ezikhaleni ezihlanzekile kufanele iphakeme kunaleyo ezikhaleni ezingezona ezihlanzekile.
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3. Iminyango phakathi kwamakamelo ahlanzekile kufanele ivulwe emakamelweni anamazinga aphezulu wokuhlanzeka.
Ukugcinwa komehluko wengcindezi kuya ngenani lomoya omusha, okufanele ukwazi ukunxephezela ukuvuza komoya kusuka kwigebe ngaphansi kwalo mehluko wokucindezela. Ngakho-ke incazelo engokomzimba yomehluko wengcindezi ukumelana nokuvuza (noma ukungena ngaphakathi) ukugeleza komoya ngokusebenzisa izikhala ezahlukahlukene egumbini elihlanzekile.
Isikhathi sePosi: UJul-21-2023