Ukuvikelwa kwemvelo kunakekelwa kakhulu, ikakhulukazi ngenxa yokwanda kwesimo sezulu esinomswakama. Ubunjiniyela begumbi elihlanzekile bungenye yezindlela zokuvikela imvelo. Ungayisebenzisa kanjani ibunjiniyela begumbi elihlanzekile ukwenza umsebenzi omuhle ekuvikelweni kwemvelo? Ake sixoxe ngokulawula ubunjiniyela begumbi elihlanzekile.
Ukulawulwa kwezinga lokushisa nomswakama ekamelweni elihlanzekile
Izinga lokushisa kanye nomswakama wezindawo ezihlanzekile kunqunywa kakhulu ngokusekelwe ezidingweni zenqubo, kodwa lapho kuhlangatshezwana nezidingo zenqubo, induduzo yomuntu kufanele icatshangelwe. Ngokuthuthuka kwezimfuneko zokuhlanzeka komoya, kunezimfuneko eziqinile zokushisa kanye nomswakama eziqhubekayo.
Njengomgomo ojwayelekile, ngenxa yokunemba okwandayo kokucubungula, izidingo zobubanzi bokushintshashintsha kwezinga lokushisa ziya ngokuya zincipha. Isibonelo, enkambisweni ye-lithography kanye nokuvezwa kokukhiqizwa kwesekethe ehlanganisiwe enkulu, umehluko ku-coefficient yokwanda kokushisa phakathi kwama-wafer engilazi nama-silicon asetshenziswa njengezinto zemaski uya ngokuya uba mncane.
I-silicon wafer enobubanzi obungu-100 μ m ibangela ukwanda okuqondile okungu-0.24 μ m uma izinga lokushisa likhuphuka nge-1 degree. Ngakho-ke, izinga lokushisa elingaguquki elingu-± 0.1 ℃ liyadingeka, futhi inani lomswakama ngokuvamile liphansi ngoba ngemva kokujuluka, umkhiqizo uzongcoliswa, ikakhulukazi ezindaweni zokusebenzela ze-semiconductor ezesaba i-sodium. Lolu hlobo lwe-workshop akufanele ludlule ku-25 ℃.
Umswakama owedlulele udala izinkinga ezengeziwe. Uma umswakama olinganiselwe udlula u-55%, ukujiya kuzokwakheka odongeni lwamapayipi amanzi apholile. Uma kwenzeka kumadivayisi noma kumasekethe anembile, kungabangela izingozi ezahlukahlukene. Uma umswakama olinganiselwe ungama-50%, kulula ukugqwala. Ngaphezu kwalokho, uma umswakama uphakeme kakhulu, uthuli olunamathele ebusweni be-silicon wafer luzomuncwa ngamakhemikhali ebusweni ngama-molecule amanzi emoyeni, okunzima ukuwususa.
Uma umswakama ohlobene uphakeme, kuba nzima ukususa ukunamathela. Kodwa-ke, uma umswakama ohlobene ungaphansi kuka-30%, izinhlayiya nazo zimuncwa kalula ebusweni ngenxa yesenzo samandla kagesi, futhi inani elikhulu lamadivayisi e-semiconductor athambekele ekuqhekekeni. Izinga lokushisa elifanele kakhulu lokukhiqizwa kwe-silicon wafer lingu-35-45%.
Umfutho womoyaukulawulaekamelweni elihlanzekile
Ezindaweni eziningi ezihlanzekile, ukuze kuvinjelwe ukungcola kwangaphandle ukuthi kungangeni, kubalulekile ukugcina ingcindezi yangaphakathi (ingcindezi engaguquki) iphakeme kunengcindezi yangaphandle (ingcindezi engaguquki). Ukugcinwa komehluko wengcindezi ngokuvamile kufanele kuhambisane nezimiso ezilandelayo:
1. Ingcindezi ezindaweni ezihlanzekile kufanele ibe phezulu kunaleyo ezindaweni ezingahlanzekile.
2. Ukucindezela ezindaweni ezinezinga eliphezulu lokuhlanzeka kufanele kube phezulu kunalezo ezisezindaweni eziseduze ezinezinga eliphansi lokuhlanzeka.
3. Iminyango ephakathi kwamakamelo ahlanzekile kufanele ivulelwe amakamelo anezinga eliphezulu lokuhlanzeka.
Ukugcinwa komehluko wokucindezela kuncike enanini lomoya omusha, okufanele ukwazi ukuvala isikhala sokuvuza komoya ngaphansi kwalo mehluko wokucindezela. Ngakho-ke incazelo engokoqobo yomehluko wokucindezela ukumelana kokuvuza (noma ukungena) komoya ogeleza ngezikhala ezahlukahlukene egumbini elihlanzekile.
Isikhathi sokuthunyelwe: Julayi-21-2023